Wafer Production Line

Wafer Production Line
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Full-automatic wafer production line features reliable performance,compact structure,small occupation,high yield,

lower energy consumption,convenient maintenance,simple operation.Operating system uses PLC programing

to make the process automated and easy control.

 

Main biscuit production we can make:

 

Capacity of the main machine:

 

Features and Characteristics:
1. All motor, electrical equipments are international standard---famous international brand or Chinese brand
2. Reasonable layout, compact structure, small occupation

3. High automatic, stable performance,machine can be controlled separately, simple operation and easy maintenance

4. Elements of wafer machine uses famous international or imported brand: motors from SEW Germany and bearings are high

temperature prevent SKF Germany. HMI operation panel and PLC unit can be Mitsubishi or Siemens. Appliances adopts Danfoss,

Schnerider, Omron. Conveyor belt is foodstuff PU quality.

 

List of complete line for reference:

NO

Name

Dimension

(L×W×H):mm

Power

KW

QTY

1

SH-R75 plates Baking oven

14730×2000×2400

18.3

1

2

Sheet receiver

1723×1150×820

0.18

1

3

Cooling tower

2600×1050×2430

0.55

1

4

Sheet Picking machine

2200 ×1060×840

0.18

1

5

Cream spreading machine (one color)

2485×1200×1730

2.92

1

6

Vertical cooling cabinet

3700×1200×2612

18.83

1

7

Conveyor

2200×1050×980

0.18

1

8

Cutting and laminating machine

1545×2100×1100

0.75

1

9

Batter Mixer

1860×900×1600

5.5

1

10

Cream mixer

1700×800×1600

5.05

1

11

Smash machine

690×610×1250

3.0

1

12

Total

 

55.44

11

 

Wafer equipments in our customer’s workshop

Wafer sheet baking from oven, automatically transfer to cooling tower and cooling in the air.

Cream will be automatically applied on wafer sheet,after the cooling from cooling cabinet, wafer book cut on cutting machine.

 

Baking oven has a great and effective burning inside oven chamber

 

Automatic batter deposit with accurate positioning

 

Cream applies on wafer sheet evenly by cream scraper

 

Wafer book cut in straight and smooth on Cutting machine by sanitation blade

 

Technical Parameters for each complete line:

Item

Description

Parameters

1

Output

2.5--7.5 tons/24 hours

2

Total power

55.44 kw (380V 50Hz)

3

Rate of finished product

More than 98%

4

Gas supply pressure

0.15-0.2 Mpa

5

Air compression value

0.9M3/Min/0.8Mpa

6

Baking plate size

470mm×325mm~500mm×350mm

7

Effective cutting size

455mm×315mm~485mm×340mm

8

Worker

4 person ( excluding packing workers)

 

 

 

Machines are packed in standard seaworthy package and shipped by container

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